ИрландияAdvanced Packaging & Integration Lead
3 нед. назад
ИрландияLeadHybrid
3d integrated circuitstsvmicro-bumpsflip-chip bondingthermal cyclingsimulationrf frequenciesfailure analysis
Lead advanced packaging and integration efforts for multi-chip quantum devices in a scalable quantum system.
Обязанности
- Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
- Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
- Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
- Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
- Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.
- Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.
- Own relevant technical activities with external suppliers, OSATs, and research partners.
- Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.
Другое
- We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system.
- In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution.
- Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.
- 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
- Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
- Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
- Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.
- Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.
- Experience with cryogenic electronics, semiconductor physics, or silicon spin qubits.
- Knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics.
- Experience leading or mentoring engineers in a high-tech, fast-paced R&D environment.