Франция3D Integration Engineer H/F
1 мес. назад
ФранцияHybrid
Integration engineer position at Alice & Bob working on superconducting qubit quantum computing technology.
О компании
- Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems. The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈⬛ . In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously! We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together! Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems. The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously! We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together! We are seeking a Senior 3D Integration Engineer H/F to join the Proce
Требования
- PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience
- 3+ years of demonstrated 3D integration experience, in flip-chip / bump bonding and TSV processing.
- Proven track record of developing and qualifying an integration process brick end to end — from literature survey and test-vehicle design through experiments, data analysis, and go/no-go decision
- Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross-sectioning, SEM, X-ray inspection / tomography, profilometry, electrical test structures
- Understanding of superconducting QPU fabrication and of what cryogenic operation demands from materials and interfaces is a plus
Как откликнуться
- Screening Call with Alexandra Talent Acquisition Specialist (30 min)
- Hiring Manager Interview with the Hiring Manager (45 min)
- Technical Interview/Presentation with the Team (90 min)
- Leadership and Fit Interview (60 min)
Другое
- Identify and benchmark enabling 3D assembly technologies for QPUs in accordance with superconducting-circuit constraints: material/process compatibility, microwave performance, and cryogenic reliability
- Develop and qualify the 3D integration building blocks — airbridges, flip-chip bonding, TSV, multi-layer wiring (MLW), superconducting interconnects, and wafer-level assembly — in close collaboration with fabrication and packaging teams
- Develop and coordinate integration test plans in collaboration with cross-functional teams
- Establish scalable, well-documented integration procedures to support system growth
- Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets
- Act as the technical point of contact for 3D integration with external foundries, packaging partners, and equipment vendors, in close collaboration with our foundry partnerships expert