USAPrincipal System/Rack Mechanical Engineer
4 дн. назад
USALead
mechanical architecturesystem integrationrack-scale infrastructure
Lead mechanical architecture and system integration for next-generation AI and rack-scale infrastructure platforms.
Обязанности
- This is a highly visible leadership role responsible for developing mechanical architecture across:
- PCIe Scale-Up AI Infrastructure
- UALink Rack-Scale Fabrics
- Ethernet Scale-Out Systems
- ESUN Network Architectures
- GPU Compute Platforms
- Open Rack Systems
- Fiber Connectivity Infrastructure
- NPO (Near Package Optics)
- CPO (Co-Packaged Optics)
- Air-Cooled and Liquid-Cooled AI Platforms
- You will work closely with Thermal, Power, Electrical, Silicon, Software, and System Architecture teams, as well as ODM partners including Accton, Hyve, Wistron, Quanta, and Gigabyte.
Требования
- Bachelor's, Master's, or PhD in Mechanical Engineering or related discipline.
- 15+ years of experience in mechanical design and system integration.
- Proven experience leading mechanical architecture for: Servers
- Networking Platforms
- Storage Systems
- AI Infrastructure
- Data Center Hardware
- Expertise in: Sheet Metal Design
- Structural Analysis
- Tolerance Analysis
- Mechanical Packaging
- Cable Management
- System Integration
- Design for Manufacturing (DFM)
- Design for Assembly (DFA)
Будет плюсом
- Experience with Open Rack and OCP architectures.
- Experience supporting rack-scale AI infrastructure.
- Familiarity with PCIe Scale-Up and UALink architectures.
- Experience with Ethernet and optical networking systems.
- Knowledge of fiber connectivity solutions and optical packaging.
- Experience supporting NPO and CPO platforms.
- Experience developing liquid-cooled infrastructure.
- Experience working directly with ODM/JDM manufacturing partners.
Условия
- You will help define the mechanical architecture for next-generation technologies including:
- PCIe Scale-Up AI Fabrics
- UALink Scale-Up Networks
- Ethernet Scale-Out Infrastructure
- ESUN Network Architectures
- NPO and CPO Optical Platforms
- Advanced Fiber Connectivity Solutions
- Open Rack AI Systems
- Future AI Factory Deployments
- This is an opportunity to drive the mechanical design of industry-leading products that power the world's largest AI clusters.
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Другое
- Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at.
- Location: Research Triangle Park (RTP), North Carolina Department: Hardware Engineering / System Architecture Employment Type: Full-Time
- We are seeking a Senior Principal Mechanical Engineer to lead mechanical architecture and system integration across next-generation AI platforms, optical networking systems, and rack-scale infrastructure solutions.
- Define mechanical architecture from device-level products through complete rack-scale AI systems.
- Develop scalable mechanical designs supporting future generations of AI infrastructure.
- Establish system-level design requirements balancing: Performance
- Reliability
- Manufacturability
- Serviceability
- Cost
- Sustainability
- Own mechanical architecture for:
- GPU Compute Platforms
- PCIe Scale-Up Switch Platforms
- UALink Switch Platforms
- Optical Connectivity Systems
- Rack Controllers
- Rack Enclosures
- Cable Management Systems
- Open Rack Platforms
- Drive solutions that support high-density AI computing deployments.
- Define rack layouts and mechanical interfaces.
- Develop scalable rack architecture standards.
- Drive mechanical integration of: Compute systems
- Switch platforms
- Power shelves
- Cooling infrastructure
- Optical connectivity
- Management systems
- Support future multi-rack AI factory deployments.
- Develop mechanical solutions supporting:
- Fiber Infrastructure
- Optical Engines
- Silicon Photonics
- NPO Architectures
- CPO Architectures
- Rack-to-Rack Optical Connectivity
- Address challenges associated with:
- Cable routing
- Bend radius management
- Serviceability
- Fiber protection
- Field replaceability
- Partner with Thermal Engineering teams to:
- Optimize airflow architecture.
- Develop liquid cooling mechanical solutions.
- Support cold plate integration.
- Define coolant distribution infrastructure.
- Improve overall system cooling efficiency.
- Define manufacturing-ready mechanical solutions.
- Support supplier and ODM engagement.
- Drive cost optimization efforts.
- Establish assembly and service procedures.
- Improve production scalability and operational efficiency.
- Work closely with:
- Electrical Engineering
- Thermal Engineering
- Power Architecture
- Silicon Development
- Product Management