USASr. Principle Systems / Rack Thermal Engineer
4 дн. назад
USASeniorOnsite
thermal analysisthermal managementsystem architecture
Lead thermal architecture and strategy for next-generation AI systems and rack-scale infrastructure.
Обязанности
- This is a highly visible technical leadership role responsible for defining thermal strategy across:
- PCIe Scale-Up Fabrics
- UALink Scale-Up Networks
- Ethernet Scale-Out Fabrics
- ESUN Network Architectures
- Advanced Fiber Connectivity Solutions
- GPU Compute Platforms
- Rack-Scale AI Systems
- Near Package Optics (NPO)
- Co-Packaged Optics (CPO)
- Air-Cooled and Liquid-Cooled Open Rack Platforms
- You will work closely with System Architects, Mechanical Architects, Power Architects, Silicon Engineering Teams, Software Architects, and ODM partners such as Accton, Hyve, Quanta, Wistron, and Gigabyte.
Требования
- BS, MS, or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Physics, or a related discipline.
- 15+ years of thermal engineering experience.
- Proven track record leading thermal architecture for AI infrastructure, networking platforms, servers, storage, or hyperscale systems.
- Deep expertise in: Heat Transfer
- Conduction and Convection
- Airflow Optimization
- Thermal Characterization
- Cooling System Design
- Rack-Level Thermal Architecture
- Hands-on experience using: ANSYS Icepak
- FloTHERM
- 6SigmaET
- CFD tools and methodologies
- Strong experience with thermal validation and correlation techniques.
Будет плюсом
- Experience supporting NVIDIA, AMD, or Intel-based AI platforms.
- Experience with Open Rack and OCP architectures.
- Expertise in liquid cooling technologies.
- Familiarity with PCIe Scale-Up and UALink systems.
- Experience with Ethernet scale-out networking.
- Experience supporting optical technologies including: NPO
- CPO
- Optical Engines
- Silicon Photonics
- Fiber Connectivity Systems
- Experience supporting rack power densities exceeding 50kW and scaling toward future 100kW–250kW deployments.
- Experience working directly with ODMs and hyperscale customers.
Условия
- You will help define the thermal architecture for technologies that power the world's most advanced AI systems, including:
- PCIe Scale-Up Infrastructure
- UALink Fabrics
- Ethernet Scale-Out Networks
- Advanced Fiber Connectivity
- NPO and CPO Optical Architectures
- Open Rack AI Platforms
- Future AI Factory Deployments
- This role offers a unique opportunity to influence industry-leading products and shape the future of rack-scale AI infrastructure.
Другое
- Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at.
- Location: Research Triangle Park (RTP), North Carolina
- Department: Hardware Engineering / System Architecture
- Employment Type: Full-Time
- We are seeking a Senior Principal Thermal Engineer to lead thermal architecture across next-generation AI systems, networking platforms, optical interconnects, and rack-scale infrastructure.
- Develop thermal architecture from silicon devices through complete rack-scale AI systems.
- Define thermal budgets, cooling requirements, and performance objectives.
- Drive architecture decisions balancing performance, reliability, power, density, and cost.
- Establish multi-generation thermal roadmaps supporting future AI infrastructure.
- Provide thermal leadership for:
- GPU Compute Platforms
- PCIe Scale-Up Switch Platforms
- UALink Switch Systems
- Ethernet Scale-Out Platforms
- Rack Controllers
- AI Accelerators
- Optical Interconnect Systems
- Develop system-level cooling strategies supporting next-generation high-density AI deployments.
- Architect airflow solutions for high-performance computing systems.
- Define direct liquid cooling and cold plate solutions.
- Support advanced rack cooling technologies.
- Develop thermal strategies for future 100kW+ AI racks.
- Optimize thermal performance while reducing infrastructure cooling cost.
- Develop thermal solutions for:
- Near Package Optics (NPO)
- Co-Packaged Optics (CPO)
- Optical Engines
- Silicon Photonics Platforms
- Fiber Connectivity Infrastructure
- Optical Transceivers and Modules
- Address thermal interactions between:
- Optical engines
- High-speed SerDes
- Switch ASICs
- GPU interconnects
- Rack cooling systems
- Lead CFD simulation activities.
- Perform system-level airflow analysis.
- Develop thermal design guidelines.
- Correlate thermal simulations with lab measurements.
- Establish validation procedures and thermal KPIs.
- Work directly with ODM and JDM partners to:
- Define thermal requirements
- Review rack and platform thermal designs
- Resolve thermal bottlenecks
- Support qualification and manufacturing readiness
- Ensure compliance with Open Rack design objectives
- Collaborate closely with:
- System Architecture
- Mechanical Engineering
- Power Architecture
- Electrical Engineering
- Silicon Design
- Reliability Engineering
- Manufacturing Operations
- to deliver industry-leading AI infrastructure solutions.
- The ideal candidate will demonstrate:
- Strong systems thinking
- Strategic technology leadership
- Cross-functional influence