Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)

1 нед. назад

SingaporeWorldwideOnsite

process developmentyield optimizationroot-cause analysisprocess qualificationequipment engineering

Process Engineer for microelectronics packaging and optical module assembly in volume manufacturing ramp-up.

We are seeking hands-on Process Engineers to support our volume manufacturing ramp-up at our Bulim facility. In this role, you will be responsible for process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.
Process Setup & Optimization: Establish robust process windows, parameter recipes, and standard operating procedures (SOPs) for assigned production modules (DB, WB, AA, or End-to-End Line Integration).
Yield & Defect Reduction: Monitor line yield metrics, lead 8D root-cause failure analysis (FA), and implement corrective actions for recurring process/equipment defects.
NPI to Mass Production: Partner with NPI and Equipment Engineering to qualify new tooling, materials (epoxies, substrates, bonding wire), and automation platforms for high-volume ramp.
Statistical Process Control: Apply SPC, DOE, FMEA, and Cpk analysis to drive process stability, cycle time reduction, and cost-efficiency initiatives.
Cross-Functional Collaboration: Work closely with Manufacturing Operators, Quality Engineers, and Maintenance Technicians to resolve line stops and uphold quality standards.

Education: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.
Experience: 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, surface-mount technology (SMT), or camera/optical module manufacturing.
Domain Expertise (one or more of the following): Die Bond (DB): Experience with epoxy/eutectic dispense, high-precision pick-and-place, and flip-chip bonding.
Wire Bond (WB): Experience with ball/wedge wire bonders (gold/copper/aluminum wire) and bond pull/shear testing.
Active Alignment (AA): Experience with multi-axis optical alignment, collimation, laser/lens positioning, and UV cure dispensing.
Overall Process: Strong background in line balancing, end-to-end yield tracking, DOE, and cleanroom protocols.
Technical Skills: Proficiency in SPC tools (JMP, Minitab), GD&T, and structured problem-solving methodologies (8D, 5-Why, Fishbone).
Work Arrangement: Willingness to work on-site at the Bulim plant and support operational needs during ramp-up phases.

Competitive salary and benefits
Opportunities for career advancement
Work with a world-class team solving cutting-edge challenges
Collaborative and innovative work environment
is committed to building a diverse and inclusive workplace. We are proud to be an equal opportunity employer.

At , we are building the essential photonics infrastructure that will drive tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, is ushering in a new era of computing that is faster, cooler, and dramatically more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who have built and scaled some of the industry’s most transformative technologies.
Die Attach (DB / Die Bond)
Wire Bond (WB)
Active Alignment (AA / Optical Alignment)
Process Engineering – Overall / Integration