Senior Principal Engineer, Mechanical Engineering, Advanced Packaging

2 нед. назад

SingaporeWorldwideLead

Senior Principal Mechanical Engineer role in Advanced Packaging at in Singapore, focusing on cutting-edge semiconductor device technology.

Требования

Bachelor’s, Master’s or PhD degree in Engineering (Mechanical, Electrical, Chemical, Systems, or similar disciplines) 
Experience in semiconductor equipment or complex technical environments 
Knowledge of CE, NFPA, Semi S2-95, and other relevant standards for semiconductor manufacturing equipment.  
Strong problem-solving mindset with system-level thinking 
Hands-on approach and ability to connect theory with real-world system behavior 
Analytical skills (DOE, data analysis, structured problem solving) 
Comfortable working across global teams and time zones 
Strong communication skills, including customer-facing interactions 
Willingness to travel internationally (~25–50%)

Другое

 
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  
At ASM, our technology powers the most advanced semiconductor devices in the world, and our people are at the heart of that innovation.   We are hiring Engineers of various experience levels across multiple KPUs, product lines, and technology domains. Joining ASM gives you  the opportunity  to join a global organization where the complexity of the challenges matches the scale of the impact. As part of our  Advanced Packaging  team,  you’ll   operate  at the intersection of  cutting-edge  technology,  engineering, field operations, and customer environments, ensuring our technologies perform reliably from early concept through high-volume manufacturing.
The Challenge  
Y ou’ll apply your  expertise to the design and development of next-generation semiconductor equipment within ASM’s Advanced Packaging team. Working alongside experienced engineers, you’ll contribute to cutting-edge mechanical systems while building deep industry knowledge. This role offers hands-on technical challenges, mentorship, and a clear pathway for growth . You’ll also play a key role across the full product lifecycle, from development and first builds through customer qualification and scale. Depending on your background, you may focus on system-level troubleshooting, new product introduction, automation, or driving performance improvements in the field.  
Contribute to design and development of semiconductor systems, including equipment selection, process controls, and automation integration.  
Manage project timelines, budgets, and resources while ensuring compliance with safety and quality standards.  
Collaborate with cross-functional teams in manufacturing, operations, and quality to align on goals and deliverables.  
Provide technical support and troubleshooting for equipment and automation systems, driving root cause analysis and resolution.  
Own BOM release and maintenance, ensuring accurate documentation and reporting for stakeholders.  
Drive continuous improvement initiatives and stay current with industry trends and emerging technologies.  
Prepare comprehensive design documentation for manufacturing and testing of prototypes and production products.  
Act as a system-level technical expert, supporting complex semiconductor equipment in both development labs and customer fabs 
Diagnose and resolve advanced system, hardware, and process issues, including escalations beyond standard support 
Drive root cause analysis (RCCA) and implement sustainable solutions across tools, sites, and product lines 
Support new product introduction (NPI), including early builds, lab validation, and ramp to high-volume manufacturing 
Lead or support first-in-fab (Alpha / Beta) deployments — installation, start-up, and qualification 
Translate field and customer feedback into design, performance, and reliability improvements 
Contribute to yield improvement, tool performance, and uptime in demanding fab environments 
Develop and share best practices, technical documentation, and global standards 
Collaborate cross-functionally with hardware, software, controls, and process engineering teams 
Lead / Support global initiatives, mentor engineers and represent ASM in customer-facing teams
 
Work across a broad range of technologies (plasma, vacuum, gas delivery, software, hardware integration)  
Operate where product development meets real-world fab performance  
High visibility and impact across engineering, operations, and customers  
 
 
 
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at  .com and on LinkedIn ,  Facebook ,  Instagram,   X  and  YouTube .
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.