Field Applications Engineer - Power Delivery

3 нед. назад

USAHybrid

chipletspower delivery networksoc design

Support customers in adopting chiplet-based power delivery network solutions for high-performance chips.

is a well-funded semiconductor startup backed by leading Silicon Valley venture capital firms. We are developing a groundbreaking chiplet solution for a fundamental shift in how high-performance chips are powered, paving the way for the next generation of AI and advanced computing. We are the first to offer a tiny device that can be integrated into a SoC package.

We are seeking a field applications engineer to support customers adopting ’s chiplet-based power delivery network (PDN) solution. This role sits at the intersection of deep technical expertise and customer engagement, serving as a critical bridge between our internal design teams and tier-one customers.
The ideal candidate is highly organized, proactive, and articulate, with the technical credibility to partner directly with customer engineering teams working on the most advanced xPU SoCs in the industry. This role offers significant opportunity for impact, ownership, and growth, contributing directly to both customer product success and ’s commercial momentum.
This position is well suited for someone who thrives in a fast-paced startup environment, anticipates needs before they arise, and enjoys being a trusted technical advisor to customers and internal teams alike.
Enable customers to design GPU/CPU SoC power solution with ’s chiplet
Assist customer’s PDN design optimization using ’s design kit
Gather customer feedback and translate insights into improvements for customer enablement and product development
Assist customers through the full adoption lifecycle, from early modeling through physical design and system bring-up
Maintain strict confidentiality and handle sensitive technical information with discretion
Act as a primary technical point of contact for tier-one customers

This role is Hybrid requiring 3 days a week onsite at either our Chandler, AZ (Greater Phoenix) office or San Jose, CA.
5 years of experience in power integrity and/or signal integrity for high-performance SoCs
Experience with package-level power integrity and signal integrity, including motherboard, substrates, interposers, and advanced packaging (2.5D / 3D)
Strong debugging skills to reproduce and resolve technical issues
Excellent written and verbal communication skills, with the ability to engage directly with customer engineering teams
High level of professionalism, discretion, and sound technical judgment
Comfortable working independently and proactively solving problems

Working experience at major processor or ASIC companies in the related technical area
Proven experience as engineering or project lead in a related technical area
Hands-on experience with electrical test methodologies and instrumentation for power or signal integrity
Experience in advanced package technologies, e.g. CoWoS, 2.5D.5D

Anticipated annual base salary for Member of Technical Staff: $150,000 - $225,000
Stock option grant
Comprehensive benefits package including health, dental, vision, and 401(k)