SingaporeWire Bond-Manufacturing Engineer
1 мес. назад
SingaporeWorldwideSenior
process engineeringroot cause analysisbonding techniquescapex management
Responsible for developing, optimizing, and sustaining wire bonding processes and equipment in semiconductor packaging to ensure high yield and reliability.
Обязанности
- Process Engineering
- Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems
- Establish and maintain process specifications, bond recipes, work instructions, and control plans
- Lead root cause analysis and corrective/preventive actions (CAPA) for wire bond process yield losses and defects
- Support NPI by developing new wire bond process flows, including DOE-driven process windows
- Perform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC)
- Drive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving
- Equipment Engineering
- Own the uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.)
- Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH (units per hour)
- Lead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders
- Collaborate with equipment vendors for technical escalations and upgrades
- Plan preventive maintenance and spare parts strategy
- Quality & Reliability
- Partner with Quality and Reliability teams on failure analysis for field and customer returns
- Support qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions
- Ensure compliance with IPC/JEDEC standards and customer requirements
- Cross-Functional Collaboration
- Work closely with Product/Design Engineering for bond pad layout and substrate design
- Partner with Process Integration, Test, and Quality to resolve yield and reliability issues
- Support cost reduction initiatives and train operators/technicians on process and equipment
- Documentation & Compliance
- Maintain process control documents, FMEAs, control plans, and traceability as per quality management systems (ISO 9001 / IATF 16949 / AS9100)
- Support internal and customer audits related to wire bond processes and equipment
Будет плюсом
- Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging
- Exposure to copper wire bonding and associated process/reliability considerations
- Experience with fine-pitch wire bonding (<50 µm) and multi-tier/stacked die bonding
- Six Sigma Green/Black Belt certification
- Familiarity with statistical software (Minitab, JMP), MES/data systems, and AOI/vision systems
- Cleanroom manufacturing experience
Условия
- Competitive salary and benefits package
- The opportunity to work on cutting-edge semiconductor packaging technology
- A collaborative, cross-functional engineering environment
- Career growth within the manufacturing/process engineering track
- is an equal opportunity employer committed to diversity and inclusion.
Другое
- At , we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.
- We are seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team within Semiconductor Assembly & Test. In this mid-to-senior level role, you will be responsible for developing, qualifying, optimizing, and sustaining wire bonding processes and equipment for semiconductor packaging operations. You will oversee process and equipment performance for ball bonding, wedge bonding, and ribbon bonding operations, ensuring high yield, reliability, and throughput, while driving continuous improvement and supporting new product introduction (NPI).
- Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering
- 3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)
- Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes
- Experience with DOE, SPC, and root cause/CAPA methods
- Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)
- Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883)
- Strong analytical, troubleshooting, and cross-functional communication skills
- Willingness to support shift or production floor needs