Lumilens
Principal Mechanical Engineer
1mo ago
WorldwideLeadthermal managementemi emc compliancematerials engineeringmechanical designindustrializationprecision tolerance engineering
Lead design, development, and industrialization of next-gen high-speed optical transceiver modules focusing on mechanical engineering aspects.
Responsibilities
- Lead end-to-end mechanical design and development of OSFP transceiver modules and related hardware
- Define module architecture, stack-up strategy, mechanical interfaces, retention mechanisms, heat spreaders, cages, and thermal paths
- Design precision components using sheet metal, die castings, injection molded plastics, CNC machined parts, and TIMs
- Optimize designs for thermal performance, structural integrity, EMI shielding effectiveness, manufacturability, reliability, and cost
- Drive advanced thermal solutions for high-power DSP and optical engines
- (Optional) Perform thermal simulations using FloTHERM, Icepak, and CFD tools
- Develop cooling strategies involving heat sinks, vapor chambers, heat spreaders, liquid cooling interfaces, and advanced TIM selection
- Lead reliability validation including thermal cycling, mechanical shock/drop, vibration, HALT/HASS, and environmental testing
- Define GD&T strategy and tolerance stack-up analysis for critical thermal and optical interfaces
- Design EMI shielding solutions including conductive gaskets, coatings, and grounding strategies
- Drive NPI activities from concept through mass production
- Establish DFM/DFA guidelines, assembly processes, quality controls, and automation opportunities
- Lead supplier qualification and manufacturing transfer activities
- Support yield improvement and root-cause analysis using 8D, DMAIC, Fishbone, and DFMEA/PFMEA
- Mentor and technically lead engineering teams
Requirements
- Bachelor’s or Master’s degree in Mechanical Engineering or related field
- 12–20+ years of experience in optical transceivers, networking systems, semiconductor packaging, or data center hardware
- Strong expertise in OSFP/QSFP mechanical systems, thermal management, and precision design
- Proficiency in Creo, SolidWorks, or NX CAD tools
- Strong understanding of GD&T, tolerance analysis, material science, EMI/EMC, and reliability engineering
Nice to have
- Experience with 800G/1.6T optical modules
- Knowledge of co-packaged optics or near-packaged optics
- Experience with copper alloys, Zamak die casting, advanced TIMs, and thermal materials
- Familiarity with OSFP MSA specifications and high-volume manufacturing models
- Six Sigma certification or patent publications preferred
Conditions
- Competitive salary and significant equity in a high-growth company
- Comprehensive health, dental, and vision insurance
- Flexible time off policy
- Direct impact on groundbreaking technology shaping the future of AI and data centers
- Opportunity to work with a highly experienced and collaborative team
- Dynamic and innovative work environment
- Opportunity for rapid career growth
- Lumilens is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, or any other protected characteristic.
Other
- At Lumilens, we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing—faster, cooler, and massively more efficient. Join our experienced team to help shape the next generation of high-speed optical connectivity.
- We are seeking an experienced Principal Mechanical Engineer to lead the architecture, design, development, and industrialization of next-generation high-speed optical transceiver modules, including 800G, 1.6T, and future pluggable platforms based on the OSFP ecosystem.
- This role requires deep expertise in high-speed electro-mechanical packaging, thermal management, precision tolerance engineering, EMI/EMC compliance, materials engineering, and large-scale manufacturing/NPI execution. You will work cross-functionally with optics, signal integrity, electrical, thermal, manufacturing, reliability, and supplier teams to deliver high-performance products at hyperscale production volumes.
- Mechanical architecture leadership
- Thermal design & simulation (optional)
- NPI & manufacturing transfer
- Supplier management
- Cost optimization / should-cost analysis
- DFMEA / PFMEA
- Root cause analysis
- Program leadership
- Executive-level technical presentation skills
- Optical networking
- Hyperscale data centers
- Semiconductor systems
- Telecom infrastructure
- AI server platforms
- High-speed interconnect products