Lumilens
Senior/Staff Process Engineer (Flip Chip)
2w ago
WorldwideLeaddoetemperature cycling testhasthtsspcprocess optimizationfailure analysis
Process development and technical support for Flip Chip manufacturing process including material characterization and failure analysis.
Responsibilities
- Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
- DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.
- Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.
- Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
- Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.
- Manage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.
- Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.
Requirements
- Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.
- Experience: 5+ years of hands-on industry experience in flip chip assembly.
- Technical Knowledge:
- Deep practical understanding of plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
- Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity.
- Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools.
- Software Tools: High proficiency with robust analytical platforms like JMP, Minitab.